Toray Engineering Co., Ltd. (Tokyo, Japan) announced the UC5000, a high-accuracy semiconductor packaging equipment for panel level packaging (PLP). Sales of the UC5000 began in April.
The UC5000 provides a solution for packaging semiconductor chips on large panels using thermal compression bonding (TCB). It supports panel sizes up to 600mm Ă— 600mm and includes compatibility with glass substrates.
Features:
The UC5000 meets SEMI Standards and supports high-accuracy semiconductor packaging for applications in AI servers and chiplet-based architectures. It is suitable for use in advanced manufacturing plants seeking large-format PLP solutions.
toray-eng.com